scia Systems GmbH announced that the North Carolina State University (NCSU) has purchased a scia Mill 200 system. The system will be used to process wide bandgap ...
We search for industry news so you don't need to. Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
The 42nd "Werner von Siemens Ring" will be awarded to the EUV development teams of ZEISS and TRUMPF. The Werner-von-Siemens-Ring Foundation is thereby honoring ... Two case studies show how advanced ...
ASMPT presents the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards in terms of precision and performance. "With its superior electrical and thermal ... In a significant step ...
In 2023, the global power electronics market, including discrete devices and modules, was valued at US$23.8 billion. It is projected to grow at a CAGR of 7.0% from 2023 to 2029 ...
The Science Based Target initiative has approved the two near-term science-based emissions reduction targets of Mycronic AB (publ). The approval marks a milestone in the ... Mycronic AB (publ) has ...
Chinese memory chip maker YMTC achieves design breakthrough despite US sanctions: Summary Yangtze Memory Technologies C ...
Advanced Packaging Drives New Memory Solutions for the AI Era: Summary AI is fueling demand for more computing power and advanced memory technologies like High-Bandwidth Memory (H ...
TSMC Begins Small-Scale Production in Arizona for Apple's A16 with the N4P Node: Summary TSMC's Arizona fab has started trial production of Apple's A16 chip using the 5nm N4P proc ...
China would love a domestic Nvidia rival — but that’s proving quite the challenge: Summary Chinese companies are ramping up efforts to produce AI chips as U.S. sanctions and N ...
Summary The EU has warned Apple to open its iPhone and iPad operating systems to rival technologies under the Digital Markets Act. Apple has six months to comply or face hefty fines. This move pushes ...